control ESD

Placement Speed: Up to 45,000 CPH

Placement Accuracy: CHIP ±0.040 mm, IC ±0.025 mm

Component Size Range: 0201 – 120 × 90 mm (including BGA, CSP, connectors)

PCB Size:

Without buffers: 50×30 mm – 1,830×510 mm

With buffers: 50×30 mm – 540×510 mm

Board Thickness: 0.4 – 4.8 mm

Component Height: Up to 30 mm (pre-placed components up to 25 mm)

Feeder Capacity: Up to 180 feeders

Placement Angle: ±180°

Board Transfer Speed: Up to 900 mm/sec

Machine Dimensions: Approx. 1,750 × 1,770 × 1,420 mm

Machine Weight: Approx. 1,500 kg